Biomedical Sensing

Sensor and Open-Source Silicon Chip for an Affordable and Robust Wearable Sensing System with Precise Temperature, Humidity, and Strain Sensing Capability [1][2]

We present the integration of the Laser-Induced-Graphene (LIG) sensors and the Analog Front-End (AFE) chip, all developed using open-source tools which facilitate an affordable prototyping for a multifunctional (temperature, humidity and strain) flexible wearable sensing system.

[1] H. Wu, A. Li, G. Kielian and M. Saligane, "LIG-OSS: Integrated Laser-Induced-Graphene Sensor and Open-Source Silicon Chip for an Affordable and Robust Wearable Sensing System with Precise Temperature, Humidity, and Strain Sensing Capability," 2024 IEEE 19th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Kyoto, Japan, 2024, pp. 1-5, doi: 10.1109/NEMS60219.2024.10639937.

[2] A. Li et al., "Rapid Prototyping of Laser-Induced Graphene Sensors With Open-Source Silicon: Paving the Way for Low-Cost and Robust Flexible Wearable Sensing," in IEEE Solid-State Circuits Magazine, vol. 16, no. 2, pp. 49-57, Spring 2024, doi: 10.1109/MSSC.2024.3380586.

Human-Body Communication (HBC) [3]

HBC systems use the human body as a conductive medium to transmit data between wearable or implantable devices, reducing radiated energy and improving privacy. A typical HBC link includes body-coupled transmitters and receivers that modulate signals through electrodes and measure the resulting potential differences across the body.

We developed an inductive-resonance transceiver using pulse-position modulation and taped it out in 16 nm technology. The associated 2026 CICC paper reports 2.2 pJ/b operation for 15 Mb/s multi-source body-area communication.

[3] A. Li et al., "A 16nm 2.2pJ/b High Efficiency Pulse-Position Modulated Resonance Transceiver for 15Mbps Multi-Source High-Speed Body-Area Sensor Network," in IEEE Custom Integrated Circuits Conference (CICC) 2026.